Brief Description
SMART Pad is commercializing a completely redesigned Chemical Mechanical Planarization (CMP) pad for the semiconductor industry. CMP processes have not changed much since their introduction by IBM in 1983, consisting of polyurethane polishing pads, polishing slurries with abrasive particles and pad conditioners for pad resurfacing.
SMART Pad co-founder Sunghoon Lee developed the company's foundational technology while earning his PhD in the lab of UC Berkeley Professor of Mechanical Engineering David Dornfeld.
Timeline
- 2018. Company founded
Inventors
David Dornfeld, Sunghoon Lee